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	<title>Comments on: Changes</title>
	<link>http://www.mrwonton.com/blog/archives/2004/08/28/changes/</link>
	<description>Trying to make sense of the world one post at a time.</description>
	<pubDate>Thu, 20 Nov 2008 08:00:29 +0000</pubDate>
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		<title>by: Nicholas Meyler</title>
		<link>http://www.mrwonton.com/blog/archives/2004/08/28/changes/#comment-1281</link>
		<pubDate>Mon, 11 Jul 2005 22:03:42 +0000</pubDate>
		<guid>http://www.mrwonton.com/blog/archives/2004/08/28/changes/#comment-1281</guid>
					<description>Any suggestions or interest?
Job Title: Fab Process Technician 
Second Shift: (also hiring for Third Shift)

JOB SUMMARY:
Main responsibilities include processing of silicon wafers in the clean room in the photolithography, metal deposition, metrology areas. The operator will work on assignments that are semi-routine in nature, where judgment is required. Normally receives detailed instruction on all work.  U.S. Security Clearance will be required. PhD and Master's degreed candidates will probably NOT be a good match for this position.

ESSENTIAL DUTIES &amp;#38; RESPONSIBILITIES:
Operate photo and deposition equipment
Setup, operate, and monitor process equipment
Process wafers in accordance with written procedures
Mix, pour, and use hazardous chemicals safely
Correctly write logs and paperwork
Ensures adherence to Company policies and procedures.
Awareness of safety for self and others.

Qualifications:
3 or more years recent semiconductor experience
Experience with the following equipment set is highly desired 
contact aligners 
Spin coaters 
E-beam and thermal evaporators 
SEM 
Basic math, good reading skills, basic writing, and good verbal communication
Ability to work with limited supervision.

WORKING CONDITIONS:
Class 1000 clean room environment, wearing clean room garments and personal protective equipment. Will be required to work around the following hazards: high voltage, high temperature heat sources and noise; and to follow the proper safety procedures.

LOCATION: Woburn, Massachusetts</description>
		<content:encoded><![CDATA[<p>Any suggestions or interest?<br />
Job Title: Fab Process Technician<br />
Second Shift: (also hiring for Third Shift)</p>
<p>JOB SUMMARY:<br />
Main responsibilities include processing of silicon wafers in the clean room in the photolithography, metal deposition, metrology areas. The operator will work on assignments that are semi-routine in nature, where judgment is required. Normally receives detailed instruction on all work.  U.S. Security Clearance will be required. PhD and Master&#8217;s degreed candidates will probably NOT be a good match for this position.</p>
<p>ESSENTIAL DUTIES &amp; RESPONSIBILITIES:<br />
Operate photo and deposition equipment<br />
Setup, operate, and monitor process equipment<br />
Process wafers in accordance with written procedures<br />
Mix, pour, and use hazardous chemicals safely<br />
Correctly write logs and paperwork<br />
Ensures adherence to Company policies and procedures.<br />
Awareness of safety for self and others.</p>
<p>Qualifications:<br />
3 or more years recent semiconductor experience<br />
Experience with the following equipment set is highly desired<br />
contact aligners<br />
Spin coaters<br />
E-beam and thermal evaporators<br />
SEM<br />
Basic math, good reading skills, basic writing, and good verbal communication<br />
Ability to work with limited supervision.</p>
<p>WORKING CONDITIONS:<br />
Class 1000 clean room environment, wearing clean room garments and personal protective equipment. Will be required to work around the following hazards: high voltage, high temperature heat sources and noise; and to follow the proper safety procedures.</p>
<p>LOCATION: Woburn, Massachusetts
</p>
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